Difference between revisions of "Sega Model 3"

From Sega Retro

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Technical specifications for the Sega Model 3 Step 1.0: {{ref|https://github.com/mamedev/mame/blob/master/src/mame/drivers/model3.cpp}}
 
Technical specifications for the Sega Model 3 Step 1.0: {{ref|https://github.com/mamedev/mame/blob/master/src/mame/drivers/model3.cpp}}
  
* Board Composition: CPU Board + VIDEO Board + ROM Board + Network/Communication Board
+
* Board Composition: CPU Board + VIDEO Board + ROM Board + Network/Communication Board + Security Board {{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Model3.h}}
 
* Main [[wikipedia:Central processing unit|CPU]]: [[wikipedia:IBM|IBM]]-[[wikipedia:Motorola|Motorola]] [[wikipedia:PowerPC|PowerPC]] [[wikipedia:PowerPC 603e|603e]] @ 66 MHz {{ref|http://www.segatech.com/archives/january1998.html}}
 
* Main [[wikipedia:Central processing unit|CPU]]: [[wikipedia:IBM|IBM]]-[[wikipedia:Motorola|Motorola]] [[wikipedia:PowerPC|PowerPC]] [[wikipedia:PowerPC 603e|603e]] @ 66 MHz {{ref|http://www.segatech.com/archives/january1998.html}}
 
** Capabilities: 64-bit bus width, 32/64-bit instructions/operations, 198 [[wikipedia:Instructions per second|MIPS]],{{fileref|TSPC603R datasheet.pdf}} 132 MFLOPS, direct high-speed access to main CROM (CPU ROM) on game ROM board {{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Model3.cpp}}{{ref|http://farm6.staticflickr.com/5471/12172411045_18bfc5912f_c.jpg}}
 
** Capabilities: 64-bit bus width, 32/64-bit instructions/operations, 198 [[wikipedia:Instructions per second|MIPS]],{{fileref|TSPC603R datasheet.pdf}} 132 MFLOPS, direct high-speed access to main CROM (CPU ROM) on game ROM board {{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Model3.cpp}}{{ref|http://farm6.staticflickr.com/5471/12172411045_18bfc5912f_c.jpg}}
Line 92: Line 92:
 
====Memory====
 
====Memory====
 
{{multicol|
 
{{multicol|
* Memory: Up to 243 [[Byte|MB]] (136 MB main, 89.157226 MB video, 17.570312 MB sound, 320 [[Byte|KB]] other) {{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Model3.cpp}}
+
* Memory: Up to 251.23 [[Byte|MB]] (144 MB main, 89.157226 MB video, 17.570312 MB sound, 512 [[Byte|KB]] other) {{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Model3.cpp}}
* [[RAM]]: 35,369 KB (34.540039 MB)
+
* [[RAM]]: 35,561 KB (34.727539 MB)
 
** Main RAM: 8 MB (3 MB [[wikipedia:SGRAM|SGRAM]]) {{fileref|KM4132G271A datasheet.pdf}}
 
** Main RAM: 8 MB (3 MB [[wikipedia:SGRAM|SGRAM]]) {{fileref|KM4132G271A datasheet.pdf}}
 
** [[VRAM]]: 25,761 KB (5121 KB framebuffers, 9248 KB textures, 1 MB [[wikipedia:Display list|display list]], 4 MB polygons, 5 MB culling,{{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Real3D.h}} 1152 KB tile generator){{ref|https://github.com/mamedev/mame/blob/master/src/mame/video/model3.cpp}}
 
** [[VRAM]]: 25,761 KB (5121 KB framebuffers, 9248 KB textures, 1 MB [[wikipedia:Display list|display list]], 4 MB polygons, 5 MB culling,{{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Real3D.h}} 1152 KB tile generator){{ref|https://github.com/mamedev/mame/blob/master/src/mame/video/model3.cpp}}
Line 100: Line 100:
 
*** [[wikipedia:SDRAM|SDRAM]]: 4 MB {{fileref|HM5241605 datasheet.pdf}}
 
*** [[wikipedia:SDRAM|SDRAM]]: 4 MB {{fileref|HM5241605 datasheet.pdf}}
 
** Sound RAM: 1096 KB (64 KB main, 1032 KB SCSP [[wikipedia:DRAM|DRAM]]; 512 KB per SCSP chip) {{fileref|HM514270 datasheet.pdf}}
 
** Sound RAM: 1096 KB (64 KB main, 1032 KB SCSP [[wikipedia:DRAM|DRAM]]; 512 KB per SCSP chip) {{fileref|HM514270 datasheet.pdf}}
** [[SRAM]]: 320 KB (192 KB security/network/communication,{{ref|http://datasheet.eeworld.com.cn/pdf/ETC/40653_N341256.pdf}} 128 KB backup [[wikipedia:Non-volatile random-access memory|NVRAM]]){{fileref|LH52B256 datasheet.pdf}}
+
** Other RAM: 512 KB (192 KB security,{{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Model3.h}} 192 KB network/communication [[SRAM]],{{ref|http://datasheet.eeworld.com.cn/pdf/ETC/40653_N341256.pdf}} 128 KB backup SRAM/[[wikipedia:Non-volatile random-access memory|NVRAM]]){{fileref|LH52B256 datasheet.pdf}}
* [[ROM]]: Up to 208.5 MB (128 MB CROM, 64 MB VROM, 16.5 MB SROM)
+
* [[ROM]]: Up to 216.5 MB {{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Model3.h}}
** ROM access time: 100 [[wikipedia:Nanosecond|nanoseconds]] {{ref|http://farm6.staticflickr.com/5471/12172411045_18bfc5912f_c.jpg}}
+
** CROM: 136 MB (CPU ROM)
** High-speed access allows ROM to effectively be used as RAM, and polygon/texture data streamed directly from VROM to the GPU.
+
** VROM: 64 MB (Video ROM)
 +
** SROM: 16.5 MB (Sound ROM)
 
}}
 
}}
  
 
====Bandwidth====
 
====Bandwidth====
 
{{multicol|
 
{{multicol|
* Main RAM bandwidth: 528 MB/sec (64-bit, 66 MHz) {{fileref|KM4132G271A datasheet.pdf}}
+
* RAM Bandwidth: 4.916 GB/sec
* [[VRAM]] bandwidth: 4.262 GB/sec
+
** Main RAM: 528 MB/sec (64-bit, 66 MHz) {{fileref|KM4132G271A datasheet.pdf}}
** Framebuffer 3D-RAM: 2.2 GB/sec (1.1 GB/sec per GPU,{{fileref|Real3D100ArchitectureOverview.pdf}} 546 MB/sec per 3D-RAM){{ref|https://web.archive.org/web/19980122143920/www.mitsubishichips.com/products/asmemory/3dram/3dramind.htm}}
+
** [[VRAM]]: 4.262 GB/sec
** Texture CDRAM: 2.062 GB/sec (8× 264 MB/sec) {{ref|http://smithsonianchips.si.edu/ice/cd/MEMORY97/SEC07.PDF}}
+
*** Framebuffer 3D-RAM: 2.2 GB/sec (1.1 GB/sec per GPU,{{fileref|Real3D100ArchitectureOverview.pdf}} 546 MB/sec per 3D-RAM){{ref|https://web.archive.org/web/19980122143920/www.mitsubishichips.com/products/asmemory/3dram/3dramind.htm}}
* Sound RAM bandwidth: 88.888889 MB/sec (2× 16-bit, 22.222222 MHz) {{fileref|HM514270 datasheet.pdf}}
+
*** Texture CDRAM: 2.062 GB/sec (8× 264 MB/sec) {{ref|http://smithsonianchips.si.edu/ice/cd/MEMORY97/SEC07.PDF}}
* SRAM bandwidth: 52.571429 MB/sec
+
** Sound RAM: 88.888889 MB/sec (2× 16-bit, 22.222222 MHz) {{fileref|HM514270 datasheet.pdf}}
** Backup NVRAM: 28.571428 MB/sec (16-bit, 14.285714 MHz) {{fileref|LH52B256 datasheet.pdf}}
+
** SRAM: 52.571429 MB/sec
** Network/Communication Board: 24 MB/sec (16-bit, 12 MHz) {{ref|http://datasheet.eeworld.com.cn/pdf/ETC/40653_N341256.pdf}}
+
*** Backup NVRAM: 28.571428 MB/sec (16-bit, 14.285714 MHz) {{fileref|LH52B256 datasheet.pdf}}
 +
*** Network/Communication Board: 24 MB/sec (16-bit, 12 MHz) {{ref|http://datasheet.eeworld.com.cn/pdf/ETC/40653_N341256.pdf}}
 +
* ROM Bandwidth: 1018.4 MB/sec {{ref|http://media.digikey.com/pdf/Data%20Sheets/Freescale%20Semi/MC88915.pdf}}{{ref|http://matthieu.benoit.free.fr/cross/data_sheets/GAL16V8B.pdf}}
 +
** CROM: 528 MB/sec (64-bit, 66 MHz)
 +
** VROM: 400 MB/sec (64-bit, 50 MHz) {{ref|https://github.com/mirror/model3emu/blob/master/Src/Model3/Real3D.h}}
 +
** SROM: 90.4 MB/sec (2× 16-bit, 22.6 MHz)
 +
** Note: High-speed access allows ROM to effectively be used as RAM, and polygon/texture data streamed directly from VROM to the GPU. {{ref|http://farm6.staticflickr.com/5471/12172411045_18bfc5912f_c.jpg}}
 
}}
 
}}
  

Revision as of 18:25, 7 December 2015

Model3 fullboard.jpg
Sega Model 3
Manufacturer: Sega
Release Date RRP Code

The Sega Model 3 is an arcade platform produced by Sega. It is a successor to the Sega Model 2 platform, and was released in 1996.

The Model 3 hardware is very different to the Sega Model 1 and Model 2 boards which preceded it. The Model 3 utilized Real3D Pro-1000 graphics processing units, designed by Real3D in partnership with Mitsubishi. The Model 3 was designed to push as many textured polygons as possible in real-time, along with the most advanced graphical techniques available at the time, such as multisample anti-aliasing, motion blur, facial animation, specular highlighting/reflection/shading, and multiple light sources. Upon release, the Model 3 board was more powerful than any other arcade platform on the market, as well as any home console or computer at the time; it took several years for home systems to catch-up to the Model 3.

The Model 3 was succeeded by the Sega NAOMI in 1998, followed by the Sega Hikaru in 1999 and Sega NAOMI 2 in 2000.

History

The Model 3 board went through a series of delays which frustrated Sega. Following their success with the Model 2's texture-mapping chip, Real3D (a spin-off company from Lockheed Martin) were unable to finalise the specifications of the Model 3's GPU, the Real3D Pro-1000 graphics processors, until late 1995 or early 1996. By this time, Real3D had partnered with Mitsubishi, which provided the ALU and graphics memory for the Pro-1000.[1] Sega had planned to release the Model 3 board in late 1995 along with three games, one of which, Indy 500, was reportedly downgraded to Model 2 hardware thanks to the troubles.[2] In late 1995, Yu Suzuki promised the Model 3 would deliver "the best 3D graphics".[3] When the Model 3 specification was finalized, it used two Real3D Pro-1000 processors, including four Mitsubishi 3D-RAM ALU chips.[4] The Model 3 eventually debuted, with Virtua Fighter 3 as its first game, at the AOU Show 1996 in February 1996, and was followed by Scud Race later that year. The board was officially supported until 1999, to make room for the Sega NAOMI and its successors, the Sega Hikaru and NAOMI 2.

The Model 3 went through a number of revisions (steps) in which improvements were made the system and board architecture was changed. These "steppings" mainly increased the clock speed of the CPU and the speed of the 3D engine, as well as minor changes to the board architecture.[4] Step 1.0 and Step 1.5 released in 1996, Step 2.0 in 1997, and Step 2.1 in 1998. Though there was much talk of Model 3 games being ported to the Sega Saturn, all home ports of Model 3 games were seen on the Sega Dreamcast, including the likes of Sega Rally 2, Virtua Fighter 3tb, Virtual-On Oratorio Tangram and Virtua Striker 2.

It was the most powerful game system in its time, an order of magnitude more powerful than PC graphics cards from 1998, which were still producing Model 2 quality graphics, two years years after the Model 3's release.[5] By 2000, the Sega Model 2 & 3 had sold over 200,000 arcade systems worldwide,[6] making them some of the best-selling arcade game boards of all time. At around $15,000 each (for the Model 2, with the Model 3 costing higher), this amounts to at least over $3 billion revenue from cabinet sales, equivalent to over $4.9 billion in 2014.

From the early 1970s, arcades had been at the forefront of graphical technology in video games. The Model 3 hardware as well as competitors from this era were also leading the industry from a graphical perspective at the time, compared to PCs which were still producing Model 2 quality graphics in 1998,[5] but the gap began to slowly narrow after that, as PCs would begin to benefit from hardware accelerated graphics towards the end of the decade. Beginning with the co-development of the Sega Dreamcast console and Sega NAOMI arcade system, both released in 1998, consoles and later PCs would slowly become the basis for arcade systems, rather than the reverse as it had been up until this point. The last proprietary Sega arcade systems would be the Sega Hikaru and Sega NAOMI 2, after which PCs would overtake arcade systems as the forefront of graphical technology. Today, arcade games are built primarily around controls and the experience one gets from a game as opposed to graphical potential. Complex motion cabinets, and large, unique forms of control unsuitable for households is what drives the arcade industry in the present day.

Technical Specifications

Step 1.0 Specifications

Technical specifications for the Sega Model 3 Step 1.0: [4]

  • Board Composition: CPU Board + VIDEO Board + ROM Board + Network/Communication Board + Security Board [7]
  • Main CPU: IBM-Motorola PowerPC 603e @ 66 MHz [8]
    • Capabilities: 64-bit bus width, 32/64-bit instructions/operations, 198 MIPS,[9] 132 MFLOPS, direct high-speed access to main CROM (CPU ROM) on game ROM board [10][11]
  • Network/Communication Board CPU: Motorola 68000 (16/32-bit) @ 12 MHz (2.1 MIPS)

Sound

Graphics

Memory

  • Memory: Up to 251.23 MB (144 MB main, 89.157226 MB video, 17.570312 MB sound, 512 KB other) [10]
  • RAM: 35,561 KB (34.727539 MB)
  • ROM: Up to 216.5 MB [7]
    • CROM: 136 MB (CPU ROM)
    • VROM: 64 MB (Video ROM)
    • SROM: 16.5 MB (Sound ROM)

Bandwidth

  • RAM Bandwidth: 4.916 GB/sec
    • Main RAM: 528 MB/sec (64-bit, 66 MHz) [26]
    • VRAM: 4.262 GB/sec
      • Framebuffer 3D-RAM: 2.2 GB/sec (1.1 GB/sec per GPU,[15] 546 MB/sec per 3D-RAM)[20]
      • Texture CDRAM: 2.062 GB/sec (8× 264 MB/sec) [31]
    • Sound RAM: 88.888889 MB/sec (2× 16-bit, 22.222222 MHz) [28]
    • SRAM: 52.571429 MB/sec
      • Backup NVRAM: 28.571428 MB/sec (16-bit, 14.285714 MHz) [30]
      • Network/Communication Board: 24 MB/sec (16-bit, 12 MHz) [29]
  • ROM Bandwidth: 1018.4 MB/sec [32][33]
    • CROM: 528 MB/sec (64-bit, 66 MHz)
    • VROM: 400 MB/sec (64-bit, 50 MHz) [25]
    • SROM: 90.4 MB/sec (2× 16-bit, 22.6 MHz)
    • Note: High-speed access allows ROM to effectively be used as RAM, and polygon/texture data streamed directly from VROM to the GPU. [11]

Step 1.5 Specifications

The Sega Model 3 Step 1.5, released in late 1996, had a higher CPU clock rate and faster 3D engine: [4]

  • Board Composition: CPU + VIDEO + ROM boards
  • Main CPU: IBM-Motorola PowerPC 603e @ 100 MHz (300 MIPS, 200 MFLOPS)

Graphics

  • Video Board: Sega 837-12875 MODEL3 STEP 1.5
  • GPU: 2× Sega 315-5830-B (Real3D Pro‑1000) @ 66 MHz
    • ALU: 4× Mitsubishi 3D‑RAM (33 MHz)
      • Performance: 528 million operations/sec, 7 million vectors/sec, 4 million tiles/sec
    • Geometrizers: 2× Geometry Engine ASIC (66 MHz, 2× 32-bit floating-point units)
    • Renderers: 2× Pixel Processors (66 MHz)
    • Texture units: 2 Texture Processors (66 MHz)
  • Geometric performance:
    • Raw polygons: 4 million triangles/sec
    • Textured polygons: 2.64 million triangles/sec (1.32 million quads/sec), with shading, translucency, anti-aliasing, fog, lighting and Z-buffering
  • 3D-RAM fillrate:
    • Framebuffers: 528 million pixels/sec (write), 2.112 billion pixels/sec (erase)
    • Polygons: 300 million pixels/sec (3 million triangles/sec), 200 million pixels/sec (4 million triangles/sec)
  • Renderer fillrate: 356 million pixels/sec (framebuffers), 132 million pixels/sec (polygons)
  • Texture fillrate: 132 million texels/sec

Step 2.0 Specifications

The Sega Model 3 Step 2.0, released in 1997, was a substantial upgrade, with a higher CPU clock rate, significantly faster 3D engine (with an increased number of graphics chips), and more memory: [4]

  • Board Composition: CPU + VIDEO + ROM boards
  • CPU: IBM-Motorola PowerPC 603ev @ 166 MHz (498 MIPS, 332 MFLOPS)

Graphics

  • Video Board: Sega 837-12716 MODEL3 STEP2
  • GPU: 6× Sega 315-6060 (Real3D Pro‑1000) @ 50 MHz [14][15]
    • ALU: 15× Mitsubishi 3D‑RAM (33 MHz, 2-3 ALU per GPU) [16]
      • Render output units: 48× 8-bit ROP/blend units (33 MHz), 24× 32-bit Z‑compare units (33 MHz)
      • Performance: 1.584 billion operations/sec, 21 million vectors/sec, 12 million tiles/sec [20]
    • Geometrizers: 6× Geometry Engine ASIC (50 MHz, 6× 32-bit floating-point units)
      • Lighting: 12 light spots, 12 spot lights
    • Renderers: 6× Pixel Processors (50 MHz)
    • Texture units: 6× Texture Processors (50 MHz)
    • Other features: 6 DMA devices, 6 tile generators, 6 Fragment Processors
  • Geometric Performance:
    • Raw polygons: 12 million triangles/sec
    • Textured polygons: 6 million triangles/sec (3 million quads/sec), with shading, translucency, anti-aliasing, fog, lighting and Z-buffering
  • 3D-RAM Fillrate:
    • Framebuffers: 1.584 billion pixels/sec (write), 6.336 billion pixels/sec (erase)
    • Polygons: 900 million pixels/sec (9 million triangles/sec), 600 million pixels/sec (12 million triangles/sec)
  • Renderer Fillrate: 810 million pixels/sec (framebuffers), 300 million pixels/sec (polygons)
  • Texture Fillrate: 300 million texels/sec
  • Video Memory:
    • Framebuffer bandwidth: 6.6 GB/sec (1.1 GB/sec per GPU, 546 MB/sec per 3D-RAM)
    • Texture RAM: 21 MB (42× 512 KB) on-board Mitsubishi CDRAM (33 MHz), 6.187 GB/sec (24× 264 MB/sec) texture RAM bandwidth [31]

Memory

  • Memory: Up to 317 MB (136 MB main, 146.835693 MB video, 33.695312 MB sound)
  • RAM: 57,567.75 KB (56.218505 MB)
    • Main RAM: 8 MB SDRAM @ 83 MHz (64-bit,[34] 666 MB/sec bandwidth)
    • VRAM: 47,959.75 KB (46.835693 MB)
      • Framebuffer RAM: 19,203.75 KB (18.75 MB Mitsubishi 3D-RAM, 3.75 KB pixel buffer SRAM cache) [17]
      • Texture RAM: 21,588 KB (21 MB Mitsubishi CDRAM, 84 KB SRAM cache,[24] 1 MB FIFO)
      • SGRAM: 7 MB [35][26]
      • Sound RAM: 1096 KB (1 MB DRAM)
      • Other RAM: 320 KB
  • ROM: Up to 260.625 MB (128 MB CROM, 100 MB VROM,[11] 32.625 MB SROM) [36]

Step 2.1 Specifications

The Sega Model 3 Step 2.1, released in 1998, is largely identical to Step 2.0, but with the following update: [4]

  • Board Composition: CPU + VIDEO + ROM boards
  • Video Board: Step 2.1: Sega 837-13368 MODEL3 STEP2.1

Hardware Images

List of Games

Step 1.0

Step 1.5

Step 2.0

Step 2.1


Sega arcade boards
Originating in arcades








  1. 1.0 1.1 http://www.thefreelibrary.com/Mitsubishi's+Graphics+Memory+Products+Power+REAL+3D's+R3D%2FPRO-1000...-a018554504
  2. File:NextGeneration US 11.pdf, page 16
  3. File:SSM_UK_02.pdf, page 21
  4. 4.0 4.1 4.2 4.3 4.4 4.5 https://github.com/mamedev/mame/blob/master/src/mame/drivers/model3.cpp
  5. 5.0 5.1 http://www.thg.ru/smoke/19991022/print.html
  6. http://web.stanford.edu/dept/HPS/TimLenoir/MilitaryEntertainmentComplex.htm
  7. 7.0 7.1 7.2 https://github.com/mirror/model3emu/blob/master/Src/Model3/Model3.h
  8. http://www.segatech.com/archives/january1998.html
  9. File:TSPC603R datasheet.pdf
  10. 10.0 10.1 https://github.com/mirror/model3emu/blob/master/Src/Model3/Model3.cpp
  11. 11.0 11.1 11.2 11.3 http://farm6.staticflickr.com/5471/12172411045_18bfc5912f_c.jpg
  12. File:ST-103-R1-040194.pdf
  13. File:Model3 cpu1.jpg
  14. 14.0 14.1 14.2 14.3 14.4 File:Real3DPro1000ProductDescription.pdf
  15. 15.0 15.1 15.2 File:Real3D100ArchitectureOverview.pdf
  16. 16.0 16.1 File:M5M410092B datasheet.pdf
  17. 17.0 17.1 17.2 File:M5M410092FP datasheet.pdf
  18. http://ieeexplore.ieee.org/iel1/4/10262/00482207.pdf
  19. htt (Wayback Machine: 2014-03-29 07:45)
  20. 20.0 20.1 20.2 20.3 20.4 htt (Wayback Machine: 1998-01-22 14:39)
  21. 21.0 21.1 21.2 https://github.com/mamedev/mame/blob/master/src/mame/video/model3.cpp
  22. https://github.com/mirror/model3emu/blob/master/Src/Model3/Real3D.cpp
  23. https://github.com/mirror/model3emu/blob/master/Src/Model3/TileGen.cpp
  24. 24.0 24.1 24.2 File:M5M4V4169TP datasheet.pdf
  25. 25.0 25.1 25.2 https://github.com/mirror/model3emu/blob/master/Src/Model3/Real3D.h
  26. 26.0 26.1 26.2 File:KM4132G271A datasheet.pdf
  27. File:HM5241605 datasheet.pdf
  28. 28.0 28.1 File:HM514270 datasheet.pdf
  29. 29.0 29.1 http://datasheet.eeworld.com.cn/pdf/ETC/40653_N341256.pdf
  30. 30.0 30.1 File:LH52B256 datasheet.pdf
  31. 31.0 31.1 http://smithsonianchips.si.edu/ice/cd/MEMORY97/SEC07.PDF
  32. http://media.digikey.com/pdf/Data%20Sheets/Freescale%20Semi/MC88915.pdf
  33. http://matthieu.benoit.free.fr/cross/data_sheets/GAL16V8B.pdf
  34. File:TC59S1616AFT datasheet.pdf
  35. File:UPD4811650 datasheet.pdf
  36. http://mamedb.com/game/spikeofe


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